Meets or exceeds original Electroglas specifications
System Features:
¡´
PC Based (CPU 600MHz or higher).
¡´
Win2000 Environment.
¡´
Network Capabilities.
Advantages:
¡´
Not dependent on the CPM floppy
operation system.
(No more expensive maintenance
on out of date components, no more double
side double density floppy)
¡´
EG2001 with embedded Microsoft
Win2000 operation system.
(Not faked through External
I/O RS232 channel)
Benefits:
¡´
Product setup files can be directly stored
and/or retrieved on Windows networking environment.
¡´
Wafer map data can be directly stored
and/or retrieved on Windows networking environment.
¡´
Print summary report through a network
printer. (No more expensive inefficient
thermal printers)
¡´
Customize summary report formats, - print
wafer maps in text format; save test result
in Data Base format.
¡´
Centralize product file control through
networking.
¡´
EG2001 can become a member of e-manufacturing.
¡´
Real Time Wafer Map.(Optional)
¡´
100% EG2001 probing feature compatible!!
Additional Probing Features:
¡´
Manual PMI(Using ¡§0¡¨key).
¡´
Double Touchdown Probing.
¡´
Customize features upon request.
Click on Photo To See Larger Image--->
Wafer Size Capacity
50mm(6in)¡B200mm(8in)
Wafer Handling
2001¡Ñ:1 Type,25slot
Accuracy
¡Ó0.35(¡Ó8.96um)includesX&Y
The0,0 reference point is taught on a center die of the first wafer.
Facility Requirements
Input Power/ Air/ Vacuum:
Base Unit: AC115/230V? 1£r 50/60Hz? 6A/3A Air: 75psi@2.3SCFM Vacuum: 23 in HG@3.0SCFM nom.
EG2080X AC115/230V ?1£r50/60Hz? 6A/3A Air: 75psi@2.3SCFM Vacuum: 23 in HG@3.0SCFM nom.
Note:All speciflcations are swbjeci to change without prior notificalion
Dimensions (includes PT 201 Table)
EG2080X Base Unit
45.40¡¨(115.3cm) x 42.60¡¨ (108.2cm) x
32.00¡¨(81.30cm) , 338.0Ibs (153.6kg)
EG2080X Fully Auto
66.33¡¨(168.5cm) x 65.35¡¨ (166cm) x
32.6¡¨(83cm) ,484.0Ibs (220kg)
Click on Photo To See Larger Image--->
Unique linear motor material
handling system provide accuate motion.
Wafer Size Capacity
Automatic
Wafer Sizing for 4", 5", 6",
8",wafers.
Accuracy
Within 0.2 mil(5um).The placement
of all die on all 10,8" wafers in the
Electrogals accuracy test are within 5um
of the desire location.The 0,0 reference
point is taught on a center die of the first
wafer.
Tester Interface Packages
All major ATE manufactures.Motorized Probe Card Theta or Semi-Automatic Probe Card changer are available on certain tester application packages.
Click on Photo To See Larger Image--->
Wafer Handling
Automatic Wafer Sizing for 100mm¡¨, 150mm, 200mm(4¡¨, 5¡¨, 6¡¨,8¡¨)
1 Cassette of 25 or 26 slots
Sequential
Programmable acces controllable via external I/O
Auxiliary wafer tray
Quick single wafer insertion and extration
Cross slot wafer detection
Intelligent Quickload pipelining
Closed-loop material handling.
Accuracy
¡Óum(system accuracy includes X,Y, £r and Z)**
**definition available upon request
XY Positioning
Travel-19.80¡¨(503mm) X,9.42 (239mm)Y
Maximum Speed-10.0 in/sec(254.0mm/sec)
Maximum Acceleration:
Standard Configuration ¡V1.1G X axis, 0.53GY axis
High Force Configuration-0.88G X axis, 0.42G Y axis
Resolution-0.01 mils(0.25um)
Repeatability-0.01 mils(0.25um)
Click on Photo To See Larger Image--->
Electroglas 2000 Series Fully Automatic Wafer Probers, for 75mm to 150 mm diameter wafers, combine high performance and reliability in a cost-effective package featuring automatic wafer alignment and belt track wafer handling.
Click on Photo To See Larger Image--->
Base unit does not feature belt track wafer handling.
Click on Photo To See Larger Image--->
Electroglas 2001 Series Fully Automatic Wafer Probers, for 75mm to 150 mm diameter wafers, combine high performance and reliability in a cost-effective package featuring HF Video Optics.
Air: 75psi@2.3SCFM
